Infrastructure

» Electron Microscopy

Scanning Electron Microscopy

Scaning Electron Microscopy methods utilize two apparatus. The electron column of the Helios NanoLab Dual Beam FIB system is exploited as an excellent SEM, used especially for images with very high resolution in the secondary electron mode. The XL-30 Phillips SEM is used especially in cathodoluminescence, EBIC (Electron Beam Induced Current) and XEDS modes, as well as in the modes of secondary and backscattered electrons.

Focused Ion Beam, used for micro- and nano-processing and Scanning Ion Microscopy.

The possessed Focused Ion Beam Helios NanoLab Dual Beam system allows for multiple types of nanoprocessing: milling/etching of all materials, deposition of metals and insulator. The system allows for fabrication of designed patterns on different materials without the use of masks (direct writing). FIB system is applied e.g. for preparation of TEM specimens (besides classical technique of argon ion milling). Scanning Ion Microscopy with ion beam enables imaging of material surface or cross-sections (e.g. fabricated previously with FIB) with the use of ions, being especially applicable for high material contrast. There are also attached two Kleindiek manipulators for micro- and nano-manipulation and local electrical measurements.

Transmission Electron Microscopy (with HRTEM - High Resolution TEM, as well)

Transmission Electron Microscopy. JEOL JEM-2100 microscope is the main TEM equipment. Among the applied techniques there are: High Resolution TEM (HRTEM), Scanning Transmission Electron Microscopy (STEM), Energy Dispersive X-Ray Spectroscopy (XEDS), High Angle Annular Dark Field (HAADF), Nano Beam Diffraction (NBD), and others.

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