Technology services

Microassembling and packaging

Die bonding, wire bonding and hermetization of semiconductor chips. We offer comprehensive service of semiconductor die and other chips assembly in metal (TO5, TO8,TO18, TO3 and similar), ...
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FIB

Examples of our FIB applications
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Technology of polymeric microcomposites assigned for manufacturing of specialized resistive components

Polymer resistive microcomposites are performed by placing of reduced in size filler (black carbon, graphite) or metallic powder (Ag, Cu, Fe etc) in polymer matrix.
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Development of special materials based on ceramics and glass

We offer possibility of development of compositions and carrying out synthesis and sintering of ceramic materials with wide range of electrical parameters.
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SMD electronic assembly using Pb-free soldering technology

Krakow Division of ITE from few years is involved in activities connected with electronic assembly. The applied research is focused on SMD technology with implementation of Pb-free soldering alloys ...
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