Microassembling and packaging
Die bonding, wire bonding and hermetization of semiconductor chips.
We offer comprehensive service of semiconductor die and other chips assembly in metal (TO5, TO8,TO18, TO3 and similar), ...
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Technology of polymeric microcomposites assigned for manufacturing of specialized resistive components
Polymer resistive microcomposites are performed by placing of reduced in size filler (black carbon, graphite) or metallic powder (Ag, Cu, Fe etc) in polymer matrix.
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Development of special materials based on ceramics and glass
We offer possibility of development of compositions and carrying out synthesis and sintering of ceramic materials with wide range of electrical parameters.
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SMD electronic assembly using Pb-free soldering technology
Krakow Division of ITE from few years is involved in activities connected with electronic assembly. The applied research is focused on SMD technology with implementation of Pb-free soldering alloys ...
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